Fab-Free Materials Testing

Characterise OSCs
without the fab.

Syent's pre-patterned substrates let you characterise organic semiconductors directly, without photolithography or cleanroom access.

Why fab-free?

Organic semiconductor research is bottlenecked by access to patterned test structures. Our substrates remove the photolithography step, so your material arrives, you deposit it, and you measure.

No Cleanroom Required

Metal contacts are pre-patterned by Syent. You bring your semiconductor and deposit it however your material suits. No UV exposure, developer or resist ever touches your film.

Immediate Measurement

Substrates ship probe-station ready with standard contact geometries. Connect your analyser and begin characterisation the same day your material arrives.

Patterning Without a Fab

Your semiconductor is patterned mechanically as part of the workflow. A sacrificial top layer peels away and carries the unwanted material with it, defining the device without a single fab step.

OECT Substrate

Pre-patterned gold source and drain contacts with a pre-patterned insulator layer, designed for standard OECT characterisation. Deposit your organic semiconductor across the channel, peel, and begin electrical testing immediately. Compatible with electrolyte-gated device configurations, and ships ready to use with full measurement documentation.

Contact Material
Au
Gate
In-plane Au, in-plane Ag/AgCl, or external Ag/AgCl
Substrate
SiO2 or glass
Channel Dimensions
10 × 100 µm (L × W)
Channels per Substrate
3–64
Lead Time
30 days

Custom layouts and channel geometries can be accommodated — tell us what you need when you request a quote.

PDMS Gasket Kit

Confines the electrolyte to the channel area, giving consistent wetting and repeatable device-to-device measurements.

Ag/AgCl Ink, 2 mL

For defining in-plane Ag/AgCl gate electrodes directly on the substrate.

Ag/AgCl Pellet Electrode

External reference gate for measurements that need a stable, well-defined gate potential.

Three steps from material to data.

The standard OSC characterisation workflow requires fabrication infrastructure most labs do not have. Our substrates move that bottleneck, giving you device-level measurements from your own material and a single deposition step.

The substrate is compatible with standard probe station geometries and benchtop electrolyte configurations.

Step 01
Deposit

Apply your semiconductor over the substrate using whichever method your material suits — spin-coating, drop-casting, blade coating, inkjet or screen printing. No adaptation to our process is needed.

Step 02
Peel

Patterning happens mechanically. A sacrificial top layer lifts away and takes the unwanted semiconductor with it, leaving your film defined only where the device needs it. No photoresist, developer or UV exposure touches your material.

Step 03
Measure

Connect to your probe station and start acquiring. You can easily measure output and transfer characteristics, peak transconductance, threshold voltage, on/off current ratio, switching time constants, leakage currents and optoelectronic response.

Ready to skip
the cleanroom?

Request a quote, or enquire about custom substrate geometries, bulk orders, or bespoke configurations for your research programme. Quotes include price and lead time.

Custom geometries and bulk orders available on request.